$1,787.99 CAD

HPE 32GB DDR4 SDRAM Memory Module

Are you looking for enterprise-quality server memory at a lower cost? Small and medium business owners often must choose between the need for high-performance server memory that supports their workloads and the simultaneous desire to control capital and operating expenses. With HPE DDR4 Standard Memory, you don't need to choose between performance and cost efficiency. HPE Standard Memory options are designed to deliver performance, reliability and efficiency at an affordable price. Unlike third-party alternatives, HPE Standard Memory is sourced from the highest-quality DRAMS and undergoes a rigorous testing and authentication process. This extensive testing ensures that it is completely compatible with and optimized for entry-level HPE server platforms to perform to industry-defined specifications.


  • 3200 MHz of memory speed with Unbuffered signal and CL22 latency skillfully manages the variety of apps and computational tasks

  • DIMM 32 GB of memory to maintain symmetry with processor and hard drive and bring out the ultimate computing experience

  • DDR4 SDRAM operates at an effective bus speed with minimal power consumption and as a result, you get optimal computer performance with an improved memory heat dissipation

Product Type: RAM Module
Brand Name: HPE
Form Factor: DIMM
Length: 7.50" (190.50 mm)
Manufacturer: Hewlett Packard Enterprise
Product Name: 32GB DDR4 SDRAM Memory Module
Manufacturer Part Number: P43022-B21
Manufacturer Website Address: http://www.hpe.com
Number Of Pins: 288-pin
Thickness: 0.75" (19.05 mm)
Weight (Approximate): 1.55 oz (44 g)
Feature1: 3200 MHz of memory speed with Unbuffered signal and CL22 latency skillfully manages the variety of apps and computational tasks
Feature2: DIMM 32 GB of memory to maintain symmetry with processor and hard drive and bring out the ultimate computing experience
Feature3: DDR4 SDRAM operates at an effective bus speed with minimal power consumption and as a result, you get optimal computer performance with an improved memory heat dissipation

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